CPA-06
Eliminate the scattering of Resist Chip
– No blowing by air so that tidiness is raised
– Possible to handle baseboard as thin as 40µm
CPA-06
Eliminate the scattering of Resist Chip
– No blowing by air so that tidiness is raised
– Possible to handle baseboard as thin as 40µm
HLM-AV610
– Package: Excellent conformity
– Gold plating: Increse adhesion
– Vacuum laminator is about 2 times better than regular laminator
HGL-600
No Vacuum Lamination
– No friction between PET the machine
Tidiness UP
– Eliminate the genaration of chip by half-cutting
– Reduce the source of foreign substances by removing the operator
– Restrain the scattering of foreign substances by removing the air blow
FPC
– For Flexible Printed Circuits
HLM-A60 Series
Features
– No tucking lamination System
– Foreign substance reduction
– Long life cutter