CPA-06

Eliminate the scattering of Resist Chip

– No blowing by air so that tidiness is raised

– Possible to handle baseboard as thin as 40µm

HLM-AV610

– Package: Excellent conformity

– Gold plating: Increse adhesion

– Vacuum laminator is about 2 times better than regular laminator

HGL-600

No Vacuum Lamination

– No friction between PET the machine

Tidiness UP

– Eliminate the genaration of chip by half-cutting

– Reduce the source of foreign substances by removing the operator

– Restrain the scattering of foreign substances by removing the air blow

FPC

– For Flexible Printed Circuits

HLM-A60 Series

Features

– No tucking lamination System

– Foreign substance reduction

– Long life cutter